Henan Baililai Superhard Material Co., Ltd.

Henan Baililai super hard Materials Co., Ltd.

 

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Home ProductsDiamond Abrasive PowderGeneral Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A

General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A

    • General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A
    • General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A
    • General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A
    • General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A
    • General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A
  • General Synthetic Diamond Micron Powder Abrasive Material High Strength CSDM-A

    Product Details:

    Place of Origin: china
    Brand Name: Henan Baililai Superhard Materials Co., Ltd.
    Certification: Henan Baililai Superhard Materials Co., Ltd.
    Model Number: General Diamond Micron Powder CSDM-A

    Payment & Shipping Terms:

    Packaging Details: 4-layer packaging bag upside down head packaging, label affixed to the outermost layer
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    Detailed Product Description
    Name: Diamond Dust Abrasive Usage: Polishing
    Abrasive Grain Sizes: 0/0.5 – 50/60 Application: Abrasive Refractory Industry
    Color: According To Customers To Choose And Buy Products Material: Synthetic Diamond

    General Diamond Micron Powder CSDM-A
     
    Features: high strength type powder, is the choice of high-strength high-quality single Crystal Diamond CSD30 as a raw material, the use of advanced production and processing technology, the crushing, shaping, purification, grading and other processes processing,product pale yellow, crystalline rules, impurities very low content, low magnetic, particle size distribution is concentrated, high strength, with excellent dispersion and wear resistance.
    Use: suitable for the production of metal bonding Agent tools, ceramic bonding Agent tools, various types of plating tools, etc., for organic and inorganic brittle materials cutting, grinding, polishing.Such as: cutting single crystal silicon Sapphire wire saw, precious stones and semiconductor precision cutting blade, also applies to single crystal silicon, polycrystalline silicon, Diamond, precious stones, Sapphire, quartz plate, LED Sapphire substrate, liquid crystal glass, high-precision magnetic materials, Semiconductors and other high-new material grinding, polishing tools.
     
    Specification table :
     

    Grade
    Size

    ACMCSDM-DCSDM-C CSDM-BCSDM-A
    0-0.05  YYY
    0-0.1  YYY
    0-0.125  YYY
    0-0.2 YYYY
    0-0.25 YYYY
    0-0.5YYYYY
    0-1YYYYY
    0-2YYYYY
    1-2YYYYY
    1-3YYYYY
    2-3YYYYY
    2-4YYYYY
    2-5YYYYY
    3-5YYYYY
    4-6YYYYY
    4-8YYYYY
    5-7YYYYY
    5-10YYYYY
    6-12YYYYY
    7-10YYYYY
    8-12YYYYY
    8-16YYYYY
    10-14YYYYY
    10-20YYYYY
    14-20YYYYY
    12-22YYYYY
    15-25YYYYY
    20-28YYYYY
    20-30YYYYY
    22-36YYYYY
    20-40YYYYY
    28-40YYYYY
    30-40YYYYY
    40-50YYYYY
    40-60YYYYY
    50-60YYYYY

     
     

    Contact Details
    Henan Baililai Superhard Material Co., Ltd.

    Contact Person: Baililai

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